Intel Silicon, Platform Innovations Speed Advances in Mobile Computing

Manila Bulletin, March 12, 2004 | Go to article overview

Intel Silicon, Platform Innovations Speed Advances in Mobile Computing


SAN FRANCISCO From new audio and video experiences to closed-lid access to email, Intel Corporation today showed how the evolving capabilities of mobile computing are attracting new users and creating new opportunities for developers.

New mobile products, platform innovations and industry enabling programs are helping to grow both the overall size of the notebook market segment and the number of notebooks sold as a percentage of total PC shipments, said Anand Chandrasekher, Intel vice president and general manager of Intels Mobile Platforms Group.

Speaking at the recent Intel Developer Forum, Chandrasekher outlined Intels plans to enhance Intel Centrino mobile technology and the Intel Pentium M processor. He also highlighted new concept mobile PCs with features designed to reshape mobile computing for a wide variety of users.

In the last year, enterprise customers have repeatedly told us that a laptop based on Intel Centrino mobile technology is the best laptop available, said Chandrasekhar. With compelling new mobile platform capabilities and the tremendous industry momentum around Wi-Fi and Intel Centrino mobile technology, we envision a rise in new and innovative applications for mobile computing in both the enterprise and the home.

Driving Momentum Through Silicon Innovation

Intels product roadmap for 2004 will further advance the mobile computing experience with even higher performance and more wireless connectivity choices, and by enabling longer battery life in thin and light designs. In the second quarter of 2004, Intel plans to introduce a higher-performing Intel Pentium M processor (code-named Dothan), and in the second half of 2004 Intel plans to update all the elements of Intel Centrino mobile technology with the Sonoma platform introduction. Sonoma includes a new Intel Pentium M processor with a faster, 533 MHz front-side bus; a new Wi-Fi component that supports the 802.11a, 802.11b and 802.11g wireless networking standards; and, a new chipset code-named Alviso. The chipset will support third-generation graphics and enable support for devices and standards such as Direct Media Interface with improved bandwidth, TV-out, high definition audio, eight USB ports, four-port PCI Express, and up to 2GB of DDR2 memory. Alviso will also support Intel High Definition Audio with low power capabilities to reduce power consumption by allowing the processor to remain in a sleep state while audio activity is happening. …

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Intel Silicon, Platform Innovations Speed Advances in Mobile Computing
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